Super rugged latest 11th generation Intel® Core® Congatec module with onboard memory
Anti-shock and anti-vibration
Shanghai, China, 15 July 2021 * * * German Congatec, a leading supplier of embedded and edge computing technology, launched a new computer module based on the 11th generation Intel® Core® processor with onboard memory to achieve the highest level of Anti-shock and anti-vibration performance. Designed for the extreme operating temperature range of -40°C to +85°C, this COM Express Type 6 computer module is resistant to shock and vibration when operating in challenging transportation and mobile applications. For economical applications, Congatec also provides cost-optimized Intel® Celeron®-based module versions that support shock and vibration resistance from 0°C to 60°C. Typical customers of new computer modules based on the TIger Lake micro-architecture, including rail transit, commercial vehicles, construction machinery, agricultural vehicles, autonomous driving robots, and other mobile applications in the most challenging outdoor and off-road environments OEM (original equipment manufacturing) Quotient).
Shock- and vibration-resistant fixed equipment is another important application area because digitalization requires critical infrastructure protection (CIP) for earthquakes and other mission-critical events. All these applications can now benefit from ultra-fast LPDDR4X memory (speeds up to 4266MT/s), and in-band error correction code (IBECC) to achieve single failure tolerance and high data transmission quality in EMI critical environments.
Value-added equipment includes rugged mounting options for modules and carrier boards, active and passive cooling options, optional protective coatings to prevent moisture or condensation corrosion, recommended carrier board schematics, and extended temperature ranges Components with high reliability, shock, and vibration resistance. In addition to these impressive technical features, Congatec also provides comprehensive services, including shock and vibration testing, temperature screening, high-speed signal compatibility testing, design services, and simplified embedded computer technology designed for customized systems. Use all required training courses, etc.
Advantages and characteristics
The new module based on the new low-power and high-density 11th generation Intel® Core® SoC have significantly higher CPU performance, nearly 3 times better GPU performance than the previous generation, and the most advanced PCIe Gen4 support. The most demanding graphics and computing workloads can benefit from up to 4 cores, 8 threads, and up to 96 graphics execution units to achieve massively parallel processing throughput in an ultra-durable form factor. The integrated graphics card that supports 8k or 4x 4k display can also be used as a parallel processing unit for convolutional neural networks (CNN) or as artificial intelligence and deep learning accelerator. The CPU that supports VNNI (VNNI) integrates the Intel AVX-512 instruction unit, which is another feature that accelerates artificial intelligence applications. Using Intel’s OpenVINO™ software toolkit, which integrates functions such as optimized calls to OpenCV, OpenCL™ cores, and other industry tools and libraries, workloads can be expanded across CPU, GPU, and FPGA computing units to accelerate computer vision and audio AI workloads for, speech and language recognition systems.
TDP can be expanded from 12w to 28w, and a fully sealed system design with passive heat dissipation can be realized. The ultra-rugged conga-TC570r COM Express Type 6 module can achieve excellent performance in real-time design, including support for time-sensitive networking (TSN), time coordinated computing (TCC), and for the deployment of virtual machines and integration work in edge computing scenarios Load RTS Hypervisor real-time monitoring program.